Printed electronics require Pick& Place (P&P) machines to assemble electrical components that cannot be printed. Such components include SMD components, Packaged Chips, and, in some cases, bare dies. We have capabilities to do assembly in a high-mix mode and a low-mix mode but with a highspeed through-put. R2R assembly processes are focussed on maturity level and throughput. Thereto this technologies increases the capacity of assembly equipment in the pilot line (Low-MIX at TNO, VTT) and (High Mix at CPI).