Assembly of Components | Technical Marketplace | SmartEEs flexible and wearable electronics ecosystem

Assembly of Components

Organization name

Offering type

TECHNICAL SERVICE

Target customers / applications

Components

Technology

[ASSEMBLY] Low mix assembly (SMD, bare die, foils) / S2S [ASSEMBLY] Low mix assembly (SMD, bare die, foils) / R2R [ASSEMBLY] High mix assembly (Packaged die) / S2S [ASSEMBLY] High mix assembly (Packaged die) / R2R [ASSEMBLY] Lamination / R2R

Offering Category

[TECHNICAL SUPPORT FOR SCALE UP] Product prototyping (TRL 4) [TECHNICAL SUPPORT FOR SCALE UP] Product Concept validation (TRL 5) [TECHNICAL SUPPORT FOR SCALE UP] Manufacturing concept validation [TECHNICAL SUPPORT FOR SCALE UP] Product and manufacturing demonstration

Applied technology

Electronics & Components Other

Field of Application

Transport/Automotive Textile Sports Security Printing and graphic arts Packaging/Logistics Ligthing Health Environment Energy Consumer electronics Building & architecture

Offering Description

Printed electronics require Pick& Place (P&P) machines to assemble electrical components that cannot be printed. Such components include SMD components, Packaged Chips, and, in some cases, bare dies. We have capabilities to do assembly in a high-mix mode and a low-mix mode but with a highspeed through-put. R2R assembly processes are focussed on maturity level and throughput. Thereto this technologies increases the capacity of assembly equipment in the pilot line (Low-MIX at TNO, VTT) and (High Mix at CPI).

Offering specifications

These technologies increase the capacity of assembly equipment in the pilot line (Low-MIX at TNO, VTT) and (High Mix at CPI).

Offering Report