Beneq TFS-500 Atomic Layer Deposition Batch tool
Centre for Process Innovation
TECHNICAL SERVICE
Materials
[LAYER DEPOSITION] Atomic Layer Deposition ALD / S2S [LAYER DEPOSITION] Other
[TECHNICAL SUPPORT FOR SCALE UP] Product prototyping (TRL 4) [TECHNICAL SUPPORT FOR SCALE UP] Product Concept validation (TRL 5) [TECHNICAL SUPPORT FOR SCALE UP] Manufacturing prototyping [TECHNICAL SUPPORT FOR SCALE UP] Manufacturing concept validation [TECHNICAL SUPPORT FOR SCALE UP] Product and manufacturing demonstration
Electronics & Components Flexible Displays OLED Lighting Organic Photovoltaics
Packaging/Logistics Ligthing Health Environment Energy Consumer electronics

The Beneq TFS-500 Atomic Layer Deposition Batch tool deposits nano-scale thicknesses of materials under highly controlled conditions in a vacuum to enable the tight control of material properties.

The TFS500 is used for depositing layers of oxide or other materials to rigid, flexible or 3d substrates.

These have applications as functional layers such as low permeation moisture vapour layers, dielectrics, CPI has capability to deposit a range of materials, and knowlege in developing processes to deposit new materials.

The ALD tool can handle single substrates of up to 300mm diameter, single rectangular substrates of Gen 2 (370 mm x 470 mm), or batches of up to 10 8” square substrates.

Processing can be carried out at reaction chamber temperatures of up to 350°c.

The equipment includes three precursor canisters including one capable of elevated temperatures upto 200°c.  

Samples can be loaded from an dry/inert nitrogen or argon atmosphere, from an attached glovebox via a loadlock.