Liquid Phase Deposition
Fraunhofer Institute for Organic Electronics, Elec
[PRINT] Screen printing / S2S [PRINT] Lift technology / S2S [PRINT] Other [LAYER DEPOSITION] Other
[R&D PROJECT / TECHNO TRANSFER / CONTRACT RESEARCH] Technology concept development (TRL 2) [R&D PROJECT / TECHNO TRANSFER / CONTRACT RESEARCH] Specific R&D contract research [TECHNICAL SUPPORT FOR SCALE UP] Manufacturing prototyping [PROVIDER OF TECH INFRASTRUCTURE] Access to Lab facilities and services
Electronics & Components Flexible Displays OLED Lighting Organic Photovoltaics
Transport/Automotive Packaging/Logistics Ligthing Health Consumer electronics

At the Fraunhofer FEP, various liquid-phase deposition processes are used and further developed. For this, versatile process equipment is available in two clean rooms (ISO 4): a screen printing tool, a slot-die coater as well as various spin coaters in ambient air and inert Nitrogen atmosphere. Among standard processes are the production of grid anode structures, passivation layers, as well as of hole-injection and hole-transport layers for use in organic semiconductor devices.

Slot-Die-Coater (nTact): semi-automated, 200mm width, ambient conditions, polar and non-polar solvents

Screen Printer: automated, 370×470mm², ambient or nitrogen conditions

Spin Coater (EVG): fully automated, 200mm wafer, polar and non-polar solvents

Spin/Spray Coater (Brewer): semi-automated, 200mm, processing of orthogonal photo chemicals

Spin Coater (Laurell): semi-automated, nitrogen atmosphere, 200mm, aqua-free solvent

Dispenser: semi-automated, nitrogen atmosphere, 200×200mm², aqua-free solvent