High-Precision Cutting | Technical Marketplace | SmartEEs flexible and wearable electronics ecosystem

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High-Precision Cutting

Organization name

Zentrum für organische Elektronik (ZOEK) gGmbH

Offering type

TECHNICAL SERVICE

Target customers / applications

Components

Technology

[STRUCTURAL ELECTRONICS] Post-process. cutting, slitting, laser

Offering Category

[R&D PROJECT / TECHNO TRANSFER / CONTRACT RESEARCH] Specific R&D contract research [PROVIDER OF TECH INFRASTRUCTURE] Access to Lab facilities and services [PROVIDER OF TECH INFRASTRUCTURE] Renting equipment

Applied technology

Other

Field of Application

Transport/Automotive Textile Sports Security Printing and graphic arts Packaging/Logistics Ligthing Health Environment Energy Consumer electronics Building & architecture

Offering Description

We offer reproducible cutting of your substrates. We also deliver cut substrates on customers demand.

Offering specifications

Materials: glass, ITO-glass, ultra-thin glass, silicon wafer

Limits: substrate size up to 300 x 300 mm², accuracy of repeatability 10µm

Offering Report