High-Precision Cutting
Zentrum für organische Elektronik (ZOEK) gGmbH
[STRUCTURAL ELECTRONICS] Post-process. cutting, slitting, laser
[R&D PROJECT / TECHNO TRANSFER / CONTRACT RESEARCH] Specific R&D contract research [PROVIDER OF TECH INFRASTRUCTURE] Access to Lab facilities and services [PROVIDER OF TECH INFRASTRUCTURE] Renting equipment
Transport/Automotive Textile Sports Security Printing and graphic arts Packaging/Logistics Ligthing Health Environment Energy Consumer electronics Building & architecture
We offer reproducible cutting of your substrates. We also deliver cut substrates on customers demand.

Materials: glass, ITO-glass, ultra-thin glass, silicon wafer

Limits: substrate size up to 300 x 300 mm², accuracy of repeatability 10µm