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PLASTRONIC
Organization name
MCVE TECHNOLOGIE
Offering type
PRODUCT
Target customers / applications
Integration
Technology
[PRINT] Screen printing / S2S
Offering Category
[R&D PROJECT / TECHNO TRANSFER / CONTRACT RESEARCH] Technology concept development (TRL 2)
Applied technology
Electronics & Components
Integrated Smart Systems
Field of Application
Transport/Automotive
Textile
Packaging/Logistics
Ligthing
Energy
Consumer electronics
Offering Description
A fully additive process: deposit of the seeding layer to initiate the metallization steps: Cu electroless plus Sn bath or Au/Ni deposit. This ideal conductive material is low cost, nontoxic, and widely available. Its viscosity and curing conditions are compatible with the deposition system used.The conductive film produced has sufficient conductivity, high uniformity, and good surface adhesion on plastic and composite substrate.
Offering specifications
Eoprom technical data sheet
Copper formulation
seeding layer prior to chemical Cu+ electrolytic Cu
Offering Report
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Offering contact email
contact@mcve-tech.com
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