SmartEEs flexible and wearable electronics
Target customers / applications
[PRINT] Screen printing / S2S
[R&D PROJECT / TECHNO TRANSFER / CONTRACT RESEARCH] Technology concept development (TRL 2)
Electronics & Components
Integrated Smart Systems
Field of Application
A fully additive process: deposit of the seeding layer to initiate the metallization steps: Cu electroless plus Sn bath or Au/Ni deposit. This ideal conductive material is low cost, nontoxic, and widely available. Its viscosity and curing conditions are compatible with the deposition system used.The conductive film produced has sufficient conductivity, high uniformity, and good surface adhesion on plastic and composite substrate.
Eoprom technical data sheet
seeding layer prior to chemical Cu+ electrolytic Cu
Offering contact email
Link to Organization registry
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