[PRINT] Screen printing / S2S
[R&D PROJECT / TECHNO TRANSFER / CONTRACT RESEARCH] Technology concept development (TRL 2)
Electronics & Components Integrated Smart Systems
Transport/Automotive Textile Packaging/Logistics Ligthing Energy Consumer electronics
A fully additive process: deposit of the seeding layer to initiate the metallization steps: Cu electroless plus Sn bath or Au/Ni deposit. This ideal conductive material is low cost, nontoxic, and widely available. Its viscosity and curing conditions are compatible with the deposition system used.The conductive film produced has sufficient conductivity, high uniformity, and good surface adhesion on plastic and composite substrate.

Eoprom technical data sheet

Copper formulation

seeding layer prior to chemical Cu+ electrolytic Cu